LA Tech home:: IfM:: Facilities:: Equipment
Black Line Equipment

Vision/Mission
Institute News

Equipment
Facilities
Research

Directory
  - Director
  - Faculty
  - Technical Staff
  - Administrative Staff
Job Opportunities


 

Institute for Micromanufacturing Laboratory Equipment by Location

I.  Nanoassembly  Laboratory (L-7):

  1. LEICA,  CTRMIC Confocal Microscope. Moved to BEC (Dr. Murray’s lab)  
  2. NIKON,  Eclipse TE2000-U Fluorescence Microscope.
  3. FUTURE DIGITAL SCIENTIFIC,  OCA 15/20 Static Contact Angle Measurement
  4. EPPENDORF,  5804R Centrifuge
  5. P&K,  Ultra Organic Film Technology Dipping Robot
  6. BROOKHAVEN INSTRUMENTS,  Zeta Plus Zeta Potential Analyzer
  7. ADMET,  Tensile Test Station
  8. INTERNATIONAL EQUIPMENT,  Centra CL3R Centrifuge
  9. TECAN,  Genios FL Plate Reader

 

 II.   Biotechnology  Laboratory (L-8):

  1. ISS,  K2 Multifrequency Phase Fluorometer
  2. ELECTRON MICROSCOPY SCIENCES,  Critical Point Dryer
  3. PHOTOPHYSICS,  Stop Flow Analyzer
  4. JASCO,  V-530 UV-VIS Spectrophotometer
  5. JASCO,   J810 Spectropolarimeter
  6. MICROCAL,  VP-ITC Microcalorimeter
  7. MICROCAL,  VP-DSC Microcalorimeter
  8. UVP,  White Light Transilluminator
  9. VULCAN,  3-550A High Temperature Box Furnace

 

III. Sensors / Electronics Assembly Laboratory (L-10):

  1. MELLEN,  SV Series Tube Furnace
  2. QUANTACHROME,  Nova 2000 Porosity Measurement System.
  3. VULCAN,  3-550 Programmable 50-1100 oC Box Furnace.
  4. VARIAN,  CP 3800 Gas Chromatograph.
  5. HEWLETT PACKARD,  5890 Series II Gas Chromatograph.
  6. STANFORD RESEARCH SYSTEMS,  QMS 200 Gas analyzer.
  7. PHILLIPS, PM 3392 200MHZ Oscilloscope.
  8. FLUKE,  8505A Digital Multimeter.
  9. NEXUS,  470 FT-IR Measurement System.
  10. AGILENT,  4396B Spectrum Analyzer.
  11. STANFORD RESEARCH,  SR760 FFT Spectrum Analyzer.
  12. TA INSTRUMENTS,  TGA Q50 Thermogravimetric Analyzer.
  13. SHIMADZU,  UV-1601PC UV-Visible Spectrophotometer.
  14. HITACHI DIGILAB,  F2500 Fluorescence Spectrophotometer.
  15. K&H,  IDL-800 Digital Lab Test Station.

 

IV.  Measurements and Characterization Laboratory   (L-11):

Microscopic Imaging Instruments

  1.  AMRAY,  1830 Scanning Electron Microscope (SEM).
  2.  ZEISS,  Libra 120 Transmission Electron Microscope (TEM).
  3. QUESANT,  Qscope 250 Atomic Force Microscope (AFM).
  4.  AGILENT,  5420 Atomic Force Microscope (AFM)
  5. PACIFIC NANOTECHNOLOGY,  NANO R SPM Atomic Force Microscope. Moved to BEC 239
  6. OLYMPUS,  Vanox AHMT3 and AX70 Optical Microscopes.
  7. OPTIMAS,  Line width Measurement System.
  8. HITACHI,  S-4800 Field-Emission Electron Microscope.
  9. LEICA,  DM4000 M Research Grade Optical Microscope.
  10. NIKON,  Labophot 2 Optical Mircroscope with Frame Grabber

 

Thin Film Measurement and Surface/bulk Characterization Systems

  1. PHI,  5800 ESCA System X-ray Photoelectron Spectroscopy. Not operational - Analyzerneeds repair ($20,000 estimate)
  2. SENTECH,  SE 850 Spectroscopic Ellipsometer.  Operational, except   IR capability not functioning
  3. ZEISS,  AXIO Speed M White-light Reflectometer.
  4. VEECO/WYKO,  NT1000 Optical Interferometer - Roughness-Step Tester (RST). Notoperational – no longer supported by Veeco – Parts not available.
  5. KLA TENCOR,  Alpha-Step IQ, Alpha-Step 500 Surface Profiler – Moved to Cleanroom
  6. DIGIMICRO,  MFC-101 thickness measurement tool.
  7. DEKTAK,  150 Surface Profiler
  8. BRUKER,   D8 Discover Multi-function X-ray Diffractometer

 

Sample Preparation

  1. CRESSINGTON,  208 HR Metal Sputter Coater.
  2. CRESSINGTON,  208 Carbon deposition.
  3. BAL-TEC,  Powertome PC Microtome. Currently located in BEC

 

V.  Research and  Instructional Laboratory (STL):

Instructional / Research Equipment:

  1. BOLD TECHNOLOGIES, combination wet processing stations with HEPA air filtration which provide local Class 1000 clean conditions.
  2. TECHNICS,  MICRO 800 table-top reactive ion etcher (RIE).
  3. JENOPTIK,  DEX-02 hot embossing system.
  4. MICRODROP,  Ink Drop Printer for flexible circuit/device fabrication.
  5. ELECTRONIC VISIONS,  EV420 optical mask aligner.
  6. SPECIALTY COATING SYSTEMS,  Model G3P-8 resist spinner.
  7. LABLINE,  Imperial IV Model 3497M3 inert gas oven for resist processing.
  8. ULTRASONIK,  temperature controlled ultrasonic bath.
  9. OLYMPUS,  Provis AX70 optical inspection microscope.
  10. OLYMPUS, SZ series stereo zoom microscope.
  11. LINDBERG / BLUE M,  Model STF 5666C triple heat zone quartz tube furnace.
  12. DENTON VACUUM,  DV-502A thermal deposition system.
  13. FIGEN,  OPC80T Osmium /Carbon coater.
  14. EXACTIX,  4.2.2.e Xenon Difluoride silicon etcher.
  15. SIKAMA,  Falcon 5 solder reflow station.
  16. TERRA UNIVERSAL,  glove box.
  17.  MARPET ENTERPRISES,  ball bonder and wedge bonder.

 

VI.  Modular Cleanroom Facility: 

Research Equipment:

  1. BOLD TECHNOLOGIES, combination wet processing station with HEPA air filtration.
  2. HERAEUS INSTRUMENTS, VT 6060 P 400 oC programmable vacuum drying oven.
  3. CEE, model 1100-600 600 oC programmable vacuum hot plate with N2 gas blanket.
  4. OLYMPUS, Vanox AHMT3 optical research microscope.
  5. TENCOR, Alpha step 500 profilometer.
  6. PLASMA THERM,  SLR 720 dual chamber Reactive Ion Etching (RIE) system
  7. PLASMA THERM, Series 790 dual chamber Plasma Enhanced Chemical Vapor Deposition (PECVD) system
  8. CHA, four-pocket, electron beam deposition system.
  9. CHA, four source thermal evaporator.
  10. PLASMA THERM, three tube Low Pressure Chemical Vapor Deposition (LPCVD) system. 
  11. UNIFILM TECHNOLOGY, PVD 300 four position sputter deposition system.
  12. CAJA INTERNATIONAL,  6-target, co-deposition sputter deposition system.
  13. HEIDLEBERG,  Laser Pattern Generator for optical mask fabrication.
  14. ELECTRONIC VISIONS, EV 420 Mask Aligner with backside alignment for photo-optical contact printing in photosensitive resist films.
  15. SUSS MICROTEC, SB6e Wafer Bonder.
  16. ALCATEL,  A601E Inductively Coupled Plasma (ICP) etcher.
  17. LEICA,  EBL 100 computer controlled 100 keV Electron Beam Lithography system. Not operational – no longer supported by Leica.
  18. CEE,  model 100 programmable resist spinner.
  19. CEE,  model 1100 programmable vacuum hot plate with N2 gas blanket.

 

Electrical Measurement Systems

  1. KEITHLEY INSTRUMENTS,   Electrical Measurement Probe Station.
  2. LAKESHORE,  75013 SCSM Hall Measurement System.

 

Magnetic Measurement Systems

  1. PRINCETON  ELECTRONICS,  Alternating Gradient Magnetometer (AGM)

 

Equipment Mechanical

  1. PRECITECH,  Optimum 2000 two axis computer controlled precision lathe. In storage
  2. MICROAUTOMATION,  1006 dicing saw
  3. MICROAUTOMATION,  2006 cleaning station.

 

VII.  General Machine Shop:

Equipment:

  1. BRIDGEPORT,  milling machine
  2. LeBLOND,  metal turning lathe
  3. MSC,  horizontal band saw
  4. MSC,  vertical band saw
  5. LINCOLN, 225 Ampere arc welding station
  6. Oxygen / acetylene gas welding / brazing station
  7. KALAMAZOO INDUSTRIES,  belt sander
  8. DELTA,  161/2 inch drill press

 

Institute for Micromanufacturing Shared Facilities at CAMD

Deep X-ray Lithography Laboratory:.

Research Equipment:

XRLM1 micromachining white light beam transport line, Port 2A, terminated by a manually operated JENOPTIK X-ray scanner exposure station.

XRLM2 micromachining beam transport line, Port 2B, terminated by a JENOPTIK fully automated X-ray scanner exposure station housed in a class 10,000 soft-wall cleanroom.


Black Line
Louisiana Tech University, A Member of the University of Louisiana System
© 2003 The Institute for Micromanufacturing
911 Hergot Avenue | Ruston, LA 71272 | 1-318-257-5100 | webmaster email: Webmaster