RESEARCH ENTERPRISE

Magnetron Sputter Machine

The AJA 2200V DC/RF magnetron sputter system is a confocal thin-film deposition tool in the sputter-up configuration. This system can be used to deposit thin-films of metals and insulators on silicon wafers or other substrates up to 4” diameters. This sputter machine is equipped with four DC magnetron guns and two RF magnetron guns. Metal films, such as Pt, Au, Ag, Ti, Cr, Cu, Zn, etc., and dielectric materials, such as SiO2, Al2O3, ZnO, and TiO2 can be deposited. Each target is 3” in diameter. This machine is also suitable for co-depositing metals to form alloys and reactive sputtering in oxygen and nitrogen to deposit metal oxides, nitrides, and oxynitrides.

Capabilities:
• Thin film deposition of pure metals, alloys, and compound insulators

• co-sputtering of two or more metals in a confocal configuration

• Reactive sputtering in nitrogen and oxygen 

• Deposition of multi-layer films with selected target materials

• Wafers up to 4” diameter can be deposited

• The substrate can be heated during deposition       

 
Contact Person:  Davis Bailey Email: dbailey@latech.edu Tel: 318-257-5111