INSTITUTE FOR MICROMANUFACTURING
Alcatel A601E – Inductively Coupled Plasma Deep Silicon Etcher
The Alcatel A601E is an Inductively Coupled Plasma (ICP) silicon etching system that offers the standard Bosch etch process capabilities. This system is capable of providing highly selective and fast silicon etching with silicon oxide and photoresists as masks. This system also features a load-lock for loading 4-inch wafers. Silicon etching and passivation processes are cycled to provide deep and anisotropic silicon etching. The etch rate can be tuned by adjusting the flow rates of SF6 and C4F8 gases, and the cycle time as well as the RF power. The silicon substrate is cooled and maintained at slightly lower temperatures to avoid breaking of the substrate during the etching process.
• Deep silicon etching (~ 50-400 µm range).
• Standard Bosch process is available.
• Silicon etch rate can be tuned.
• Only 4-inch wafers can be processed.
• Substrates are cooled during process runs.
Contact Person: Davis Bailey Email: email@example.com Tel: 318-257-5111