Micromanufacturing incorporates many of the processes developed by the integrated circuit industry as well as novel techniques developed by scientists from all technical research areas including physical chemistry, physics, engineering, and mathematics. The IfM website includes information on the micromanufacturing processes under study and in use at the facility, including brief tutorials. There is also a general background tutorial on some of the theories behind micromanufacturing.

Select Process and Metrology Equipment

Below are some pictures of a few of the pieces of equipment we have here at IfM. The names of the pieces of equipment should be listed either to the right, or left of that row of pictures. By clicking on a picture or the name of the machine, you will be taken to a different page that can tell you more about what that machine does, what it can be used for, and contact information for whom would be over that piece of equipment. This information can be used if needed to contact them about understanding it more or about setting up a time to use it. All pieces of equipment are listed lower under the pictures, sorted by location.

X-Ray Diffractometer

Stylus Surface Profiler

E-beam Evaporator

3D Laser Scanning Confocal Microscope

Plasma Deep Silicon Etcher

Magnetron Sputter Machine

Hitachi Electron Microscope

Surface Area and Pore Analyzer

Silicon Release Etcher

Hall Effect Measurement System

Spectroscpic Ellipsometer

Particle Size Analyzer

Thermogravimetric Analyzer

Laboratory Information

Nanoassembly Laboratory (L-7)

  • NIKON, Eclipse TE2000-U Fluorescence Microscope
  • FUTURE DIGITAL SCIENTIFIC, OCA 15/20 Static Contact Angle Measurement
  • EPPENDORF, 5804R Centrifuge
  • P&K, Ultra Organic Film Technology Dipping Robot
  • BROOKHAVEN INSTRUMENTS, Zeta Plus Zeta Potential Analyzer
  • ADMET, Tensile Test Station
  • TECAN, Genios FL Plate Reader


Biotechnology Laboratory (L-8)

  • ISS, K2 Multifrequency Phase Fluorometer
  • PHOTOPHYSICS, Stop Flow Analyzer
  • JASCO, V-530 UV-VIS Spectrophotometer
  • JASCO, J810 Spectropolarimeter
  • MICROCAL, VP-ITC Microcalorimeter
  • MICROCAL, VP-DSC Microcalorimeter
  • UVP, White Light Transilluminator
  • VULCAN, 3-550A High Temperature Box Furnace
  • QUANTACHROME, Nova 2000 Porosity Measurement System
  • VARIAN, CP 3800 Gas Chromatograph

Sensors / Electronics Assembly Laboratory (L-10)

  • MELLEN, SV Series Tube Furnace
  • VULCAN, 3-550 Programmable 50-1100 oC Box Furnace
  • HEWLETT PACKARD, 5890 Series II Gas Chromatograph.
  • PHILLIPS, PM 3394 200MHZ Oscilloscope.
  • FLUKE, 8505A Digital Multimeter
  • NEXUS, 470 FT-IR Measurement System
  • AGILENT, 4396B Spectrum Analyzer
  • STANFORD RESEARCH, SR760 FFT Spectrum Analyzer
  • TA INSTRUMENTS, TGA Q50 Thermogravimetric Analyzer
  • SHIMADZU, UV-1601PC UV-Visible Spectrophotometer
  • HITACHI DIGILAB, F2500 Fluorescence Spectrophotometer
  • K&H, IDL-800 Digital Lab Test Station

Measurements And Characterization Laboratory (L-11)

Microscopic Imaging Instruments

  • AMRAY, 1830 Scanning Electron Microscope (SEM)
  • ZEISS, Libra 120 Transmission Electron Microscope (TEM)
  • QUESANT, Qscope 250 Atomic Force Microscope (AFM)
  • AGILENT, 5420 Atomic Force Microscope (AFM)
  • OLYMPUS, Vanox AHMT3 and AX70 Optical Microscopes
  • OPTIMAS,  Line width Measurement System
  • HITACHI,  S-4800 Field-Emission Electron Microscope
  • LEICA, DM4000 M Research Grade Optical Microscope
  • NIKON, Labophot 2 Optical Microscope with Frame Grabber
    • KEYENCE VK-X160K Laser Microscope

Thin Film Measurement and Surface/bulk Characterization Systems

  • PHI, 5800 ESCA System X-ray Photoelectron Spectroscopy
  • SENTECH,  SE 850 Spectroscopic Ellipsometer
  • ZEISS,  AXIO Speed M White-light Reflectometer
  • VEECO/WYKO, NT1000 Optical Interferometer – Roughness-Step Tester (RST)
  • KLA TENCOR, Alpha-Step IQ, Alpha-Step 500 Surface Profiler
  • DIGIMICRO,  MFC-101 thickness measurement tool.
  • DEKTAK, 150 Surface Profiler
  • BRUKER, D8 Discover Multi-Function X-Ray Diffractometer

Sample Preparation

  • CRESSINGTON, 208 HR Metal Sputter Coater
  • CRESSINGTON, 208 Carbon deposition
  • BAL-TEC,  Powertome PC Microtome

Research And Instructional Laboratory (STL)

Instructional / Research Equipment

  • BOLD TECHNOLOGIES, combination wet processing stations with HEPA air filtration which provide local Class 1000 clean conditions
  • TECHNICS,  MICRO 800 table-top reactive ion etcher (RIE)
  • JENOPTIK,  DEX-02 hot embossing system
  • MICRODROP,  Ink Drop Printer for flexible circuit/device fabrication
  • ELECTRONIC VISIONS,  EV420 optical mask aligner
  • SPECIALTY COATING SYSTEMS,  Model G3P-8 resist spinner
  • LABLINE, Imperial IV Model 3497M3 inert gas oven for resist processing
  • ULTRASONIK, temperature controlled ultrasonic bath
  • OLYMPUS, Provis AX70 optical inspection microscope
  • OLYMPUS, SZ series stereo zoom microscope
  • LINDBERG/ BLUE M,Model STF 5666C triple heat zone quartz tube furnace
  • DENTON VACUUM, DV-502A thermal deposition system
  • FIGEN, OPC80T Osmium /Carbon coater
  • EXACTIX, 4.2.2.e Xenon Difluoride silicon etcher
  • SIKAMA, Falcon 5 solder reflow station
  • TERRA UNIVERSAL, glove box
  • MARPET ENTERPRISES, ball bonder and wedge bonder
    • ELECTRONIC VISIONS, EV 420 Mask Aligner with backside alignment for photo-optical contact printing in photosensitive resist films

Modular Cleanroom Facility

Research Equipment

  • BOLD TECHNOLOGIES, combination wet processing station with HEPA air filtration
  • SUSS MICROTEC MA6/BA6 high precision mask aligner and bond aligner
  • HERAEUS INSTRUMENTS, VT 6060 P 400 oC programmable vacuum drying oven
  • CEE, model 1100-600 600 oC programmable vacuum hot plate with Ngas blanket
  • OLYMPUS, Vanox AHMT3 optical research microscope
  • PLASMA THERM, SLR 720 dual chamber Reactive Ion Etching (RIE) system
  • PLASMA THERM, Series 790 dual chamber Plasma Enhanced Chemical Vapor Deposition (PECVD) system
  • CHA, four-pocket, electron beam deposition system
  • CHA, four source thermal evaporator
  • Three tube Low Pressure Chemical Vapor Deposition (LPCVD) system
  • UNIFILM TECHNOLOGY, PVD 300 four position sputter deposition system
  • AJA INTERNATIONAL,  6-target, co-deposition sputter deposition system
  • HEIDLEBERG, Laser Pattern Generator for optical mask fabrication
  • SUSS MICROTEC, SB6e Wafer Bonder
  • ALCATEL, A601E Inductively Coupled Plasma (ICP) etcher
  • LEICA, EBL 100 computer controlled 100 keV Electron Beam Lithography system
  • CEE, model 100 programmable resist spinner
  • CEE, model 1100 programmable vacuum hot plate with N2 gas blanket

Electrical Measurement Systems

  • KEITHLEY INSTRUMENTS,  Electrical Measurement Probe Station
  • LAKESHORE, 75013 SCSM Hall Measurement System

Magnetic Measurement Systems

  • PRINCETON ELECTRONICS, Alternating Gradient Magnetometer (AGM)

Equipment Mechanical

  • PRECITECH, Optimum 2000 two axis computer controlled precision lathe
  • MICROAUTOMATION, 1006 dicing saw
  • MICROAUTOMATION, 2006 cleaning station.

General Machine Shop

  • BRIDGEPORT, milling machine
  • LeBLOND, metal turning lathe
  • MSC, horizontal band saw
  • MSC, vertical band saw
  • LINCOLN, 225 Ampere arc welding station
  • Oxygen / acetylene gas welding / brazing station
  • DELTA, 161/2 inch drill press

Equipment Located in the Biomedical Engineering Building

  • LEICA, CTRMIC Confocal Microscope

Institute for Micromanufacturing Shared Facilities at CAMD

  • Deep X-ray Lithography Laboratory

Research Equipment

  • XRLM1 micromachining white light beam transport line, Port 2A, terminated by a manually operated JENOPTIK X-ray scanner exposure station
  • XRLM2 micromachining beam transport line, Port 2B, terminated by a JENOPTIK fully automated X-ray scanner exposure station housed in a class 10,000 soft-wall cleanroom